Free Next Working Day Delivery*

Family Run Business

Product Details

aorus master B550

RISE FROM THE DARKNESS

Introducing the all-new AORUS PRO AC B550 Motherboard from Gigabyte. Filled with the latest technologies to take your gaming experience to the next level such as PCI-E 4.0 technology to give you better performance, bandwidth and eye-watering speeds, 2.5 GBe LAN, Intel 802.11ac Wi-Fi and Bluetooth 4.2 support.

2x M.2 slots, USB 3.2 Gen2 Type-C connectivity and a high-quality audio system. Illuminate your system in your own style with Gigabytes RGB Fusion software or even have supported devices be interactive with the new gaming mode to give yourself that additional immersive gaming experience. The AORUS B550 PRO AC is designed to unleash the full potential of the 3rd Generation Ryzen CPUs, give your system the strongest foundations and make your friends and enemies envious of the power you now hold.

AMD B550 Chipset

3rd Generation Ryzen Compatible CPUs

AM4 CPU Socket

ATX Form Factor

Advanced Cooling for High-End Systems

KEEP YOUR COMPONENTS COOL

In order to guarantee un-throttled performance, Aorus have opted for an advanced thermal solution, including a Fins-array heatsink, direct touch heat pipes, upgraded thermal pads and thermal guards meaning the B550 PRO AC is capable of keeping the MOSFETs and M.2 SSDs cool and comfortable even under maximum load. Whether you're a gamer, builder or just an enthusiast you can expect lower temperatures and higher performance from the B550 PRO AC.

Features

1. DIRECT TOUCH HEATPIPEHeatpipe directly touches the heating source VRM components that guarantee good contact between VRM and the heatsink.

2. FINS-ARRAY HEATSINKThe B550 PRO AC uses a stacked-fins design which increases the heat dissipation area by 300% when compared to traditional heatsinks of the same size and also provides at least 30% lower temperature on MOSFETs.

3. LAIRD 5 W/MK THERMAL PADBy using LAIRD 5 W/mK high thermal conductivity pads, it can transfer 4x more heat as compared to traditional thermal pads at the same time.

4. 2X M.2 THERMAL GUARDBuilt-in M.2 thermal guard heatsink helps the high-speed, large capacity of PCIe 4.0/3.0 SSDs to prevent overheat throttling and performance bottlenecks.

Gigabyte AMD B550 AORUS PRO AC AM4 ATX Motherboard

SKU B550 AORUS PRO AC

Specification

Edition B550 AORUS PRO AC
Form Factor ATX
CPU Socket AM4
Chipset AMD B550
RAM Memory Support
Memory Type DDR4
Memory Channel Dual (2)
Memory Type (ECC) ECC/Non-ECC
Memory Type (R/U) UDIMM (Unbuffered)
Memory Speed (Mhz)
DDR4 – 2133
DDR4 – 2400
DDR4 – 2667
DDR4 – 2933
DDR4 – 3200
DDR4 – 3333(OC)
DDR4 – 3600(OC)
DDR4 – 4000(OC)
DDR4 – 4400(OC)
DDR4 – 4600(OC)
DDR4 – 4866(OC)
DDR4 – 5000(OC)
DDR4 – 5200(OC)
DDR4 – 5400(OC)
Max. Memory Capacity 128GB (4x32GB)
Audio
Audio
Graphics Support
Primary GPU Interface PCIe 4.0 (x16)
NVIDIA SLI Support Not Supported
AMD CrossFire Support Not Supported
Integrated Graphics Requires Processor Graphics or Discrete GPU
On-Board Graphics Connectors HDMI 2.1
Internal Connectivity
Expansion Slots
1 x M.2, 22-42/60/80/110, PCIe Gen3x4
1 x M.2, 22-42/60/80/110, PCIe Gen4x4/SATA
1 x PCIe 3.0 x16 (x2 Bandwidth)
1 x PCIe 3.0 x16 (x4 Bandwidth)
1 x PCIe 4.0 x16
SATA Support SATA3
RAID Support via
Storage Mode Support
RAID 0
RAID 1
RAID 10
Internal I/O
1 x 24-pin (Power)
4 x 4-pin CHA_FAN connector
1 x 4-pin CPU Fan Connector
2 x 4-pin Water Pump Connector
1 x 8-pin (Power)
2 x Addressable Digital RGB Header
1 x Clear CMOS jumper
1 x CPU Water Pump/Fan Connector
1 x Front Panel Audio Header
1 x Front Panel Connector
3 x RGB LED connector
6 x SATA III – 6Gb/s
2 x Temperature Sensor Header
1 x TPM Header
2 x USB 2.0 Header
1 x USB 3.2 Gen1 Header
External Connectivity
Network Interface Type
802.11ac WiFi LAN
Wired 2.5 Gigabit LAN (10/100/1000/2500)
Network Chip/Modules
1 x Intel 802.11ac WiFi/ BT4.2 Module (433Mbps)
1 x Realtek (2.5GbE LAN)
Rear I/O Connectors
1 x Center/Subwoofer Speaker Out
1 x HDMI
1 x Line In
1 x Line Out
1 x Mic-In
1 x Q-Flash Plus Button
1 x Rear Speaker Out
1 x RJ-45
1 x S/PDIF-Out (Optical)
2 x SMA antenna connectors
6 x USB 2.0
3 x USB 3.2 Gen1 Type-A
1 x USB 3.2 Gen2 Type-C
Additional Specifications
Water Cooled No
Cooling Passive Heatsinks
QPI Speed N/A
Board Dimensions 305 x 244 mm

sold out

Notify when stock available

£149.99

Product Details

aorus master B550

RISE FROM THE DARKNESS

Introducing the all-new AORUS PRO AC B550 Motherboard from Gigabyte. Filled with the latest technologies to take your gaming experience to the next level such as PCI-E 4.0 technology to give you better performance, bandwidth and eye-watering speeds, 2.5 GBe LAN, Intel 802.11ac Wi-Fi and Bluetooth 4.2 support.

2x M.2 slots, USB 3.2 Gen2 Type-C connectivity and a high-quality audio system. Illuminate your system in your own style with Gigabytes RGB Fusion software or even have supported devices be interactive with the new gaming mode to give yourself that additional immersive gaming experience. The AORUS B550 PRO AC is designed to unleash the full potential of the 3rd Generation Ryzen CPUs, give your system the strongest foundations and make your friends and enemies envious of the power you now hold.

AMD B550 Chipset

3rd Generation Ryzen Compatible CPUs

AM4 CPU Socket

ATX Form Factor

Advanced Cooling for High-End Systems

KEEP YOUR COMPONENTS COOL

In order to guarantee un-throttled performance, Aorus have opted for an advanced thermal solution, including a Fins-array heatsink, direct touch heat pipes, upgraded thermal pads and thermal guards meaning the B550 PRO AC is capable of keeping the MOSFETs and M.2 SSDs cool and comfortable even under maximum load. Whether you're a gamer, builder or just an enthusiast you can expect lower temperatures and higher performance from the B550 PRO AC.

Features

1. DIRECT TOUCH HEATPIPEHeatpipe directly touches the heating source VRM components that guarantee good contact between VRM and the heatsink.

2. FINS-ARRAY HEATSINKThe B550 PRO AC uses a stacked-fins design which increases the heat dissipation area by 300% when compared to traditional heatsinks of the same size and also provides at least 30% lower temperature on MOSFETs.

3. LAIRD 5 W/MK THERMAL PADBy using LAIRD 5 W/mK high thermal conductivity pads, it can transfer 4x more heat as compared to traditional thermal pads at the same time.

4. 2X M.2 THERMAL GUARDBuilt-in M.2 thermal guard heatsink helps the high-speed, large capacity of PCIe 4.0/3.0 SSDs to prevent overheat throttling and performance bottlenecks.

Contact

If you have any questions Please get in touch…