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Product Details

TUF Gaming B560 Motherboard

DURABLE, STABLE AND RELIABLE MOTHERBOARD

ASUS TUF GAMING B560M-PLUS comes in a Micro-ATX size and takes all the essential elements of the latest 10th and 11th gen Intel® Core™ Intel® 1200 socket processors. It also combines the Intel processors with game-ready features and proven durability with support for DDR4 memory.

Engineered with military-grade components, an upgraded power solution and a comprehensive cooling system, this motherboard offers rock-solid, stable performance for marathon gaming. Aesthetically, TUF GAMING B560M-PLUS sports the new TUF Gaming logo, and incorporates simple geometric design elements to reflect the dependability and stability that defines the TUF Gaming series.

Intel B560 Chipset

LGA 1200 CPU Socket

ATX Form Factor

Built to Take the Strain

Power Delivery EnhancementsTUF CAPACITORS

Proprietary capacitors provide up to 20% greater temperature tolerance and 5X-longer lifespan.

Power Delivery EnhancementsDIGI+VRM

The integrated Digi+ VRM voltage-regulator module (VRM) is one of the finest in the industry, ensuring ultra-smooth and ultra-clean power delivery to the CPU at all times.

Power Delivery EnhancementsTUF CHOKES

Certified military-grade TUF chokes deliver rock-steady power to the CPU, improving system stability.

POWER DELIVERY ENHANCEMENTSWith upgraded power delivery and comprehensive cooling options to drive the 11th and 10th Gen Intel® Core™ processors, plus support for faster memory and storage, TUF GAMING B560 series motherboards are the perfect foundation for your next high-core-count battle rig.

The onboard VRM of TUF GAMING B560 series motherboards utilizes 8+1 DrMOS power stages that combine high-side and low-side MOSFETs and drivers into a single package, delivering the power and efficiency that 11th Gen Intel Core processors demand. Multiple PCB layers shift heat away from critical components, providing more headroom to push CPUs beyond stock speeds. The motherboard also uses ProCool connectors that are built to tight specifications to ensure flush contact with PSU power lines. This results in lower impedance and helps to prevent hotspots and connector failure.

Cooler by Design

Identify

1. LARGER VRM HEATSINK

A larger, high-mass heatsink with extensive surface that covers the VRM and choke areas improves heat dissipation.

THERMAL PAD

High-quality thermal pads help transfer heat from the inductor and phase array to the heatsink.

2. M.2 HEATSINK

B560M-PLUS has a flexible M.2 heatsink to use on more M.2 slots and keep the M.2 SSD at the optimum operating temperature for consistent performance and reliability.

90MB1770-M0EAY0

SKU ASUS TUF GAMING B560M-PLUS Intel B560 PCIe 4.0 mATX Motherboard

Specification

  • Motherboard Type: Desktop
  • Form Factor: Micro ATX
  • Socket: Intel 1200 – Rocket Lake
  • Chipset: Intel B560
  • DDR Type: DDR4
  • CPU Support: Click here for CPU support
  • RAM Technology: DDR4 (Dual Channel)
  • RAM Slots: 4 x DIMM
  • RAM Speeds: Up to 5000(OC)
  • Maximum Memory: 128GB
  • Graphics: Integrated Graphics*
    *Graphics specifications may vary between CPU types
  • Graphics Ports: 1 x HDMI
    1 x DisplayPort
  • Multi-GPU Support:
  • PCI/PCI Express: 1 x PCIe 4.0 x16
    1 x PCIe 3.0 x16
    1 x PCIe 3.0 x1
  • Storage: 6 x SATA III
    1 x M.2 (2242/2260/2280) – PCIe*
    1 x M.2 (2242/2260/2280) – SATA & PCIe
    *This slot is only active with 11th gen CPUs
  • RAID:
  • Wireless: Intel Wi-Fi 6
    2×2 Wi-Fi 6 (802.11 a/b/g/n/ac/ax)
    Supports 2.4/5GHz frequency band
    Bluetooth v5.0 or later
  • LAN: 2.5GB LAN
  • Audio: Realtek ALC 897 7.1 Surround Sound High Definition Audio
  • USB Ports Supported: “2 x USB 3.2 Gen2 Type-A (at back)
    1 x USB 3.2 Gen1 Type-C (at back)
    4 x USB 3.2 Gen1 Type-A (2 at back, 2 at mid-board)
    8 x USB 2.0 (4 at back, 4 at mid-board)
    1 x Front Panel USB 3.2 Gen1 Type-C connector”
  • Back Panel I/O Ports: “2 x USB 3.2 Gen2 Type-A
    3 x USB 3.2 Gen1 (2 Type-A, 1 Type-C)
    4 x USB 2.0
    1 x DisplayPort
    1 x HDMI
    1 x ASUS Wi-Fi Module
    1 x Realtek 2.5Gb Ethernet
    5 x Audio jacks
    1 x Optical S/PDIF out”
  • Internal I/O Connectors: 1 x 4-pin CPU Fan
    1 x 4-pin CPU OPT Fan
    2 x 4-pin Chassis Fan
    1 x 24-pin Main
    1 x 8-pin +12V
    2 x M.2 (Key M)
    6 x SATA 6Gb/s
    1 x USB 3.2 Gen1 Type-C
    1 x USB 3.2 Gen1
    2 x USB 2.0
    2 x AURA Addressable Gen2
    2 x AURA RGB
  • .: 1 x Clear CMOS
    1 x COM Port
    1 x Front Audio
    1 x 20-3 pin System Panel
    1 x Thunderbolt
  • Accessories: 2 x SATA 6Gb/s cables
    1 x ASUS Wi-Fi moving antennas
    1 x M.2 Rubber Package
    1 x M.2 SSD screw package
    1 x TUF Gaming sticker
  • Additional Features: See Overview
  • Package Type: Retail
  • Package Weight: 1.4500 kg
  • Warranty: 3 Years
  • M.2 Slot(s): Yes (M.2)
  • RGB Lighting: Yes (RGB)
  • No. LAN Ports: 1 x LAN
  • Max LAN Speed: 2.5GB LAN
  • Wi-Fi: Yes (Wi-Fi)

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Product Details

TUF Gaming B560 Motherboard

DURABLE, STABLE AND RELIABLE MOTHERBOARD

ASUS TUF GAMING B560M-PLUS comes in a Micro-ATX size and takes all the essential elements of the latest 10th and 11th gen Intel® Core™ Intel® 1200 socket processors. It also combines the Intel processors with game-ready features and proven durability with support for DDR4 memory.

Engineered with military-grade components, an upgraded power solution and a comprehensive cooling system, this motherboard offers rock-solid, stable performance for marathon gaming. Aesthetically, TUF GAMING B560M-PLUS sports the new TUF Gaming logo, and incorporates simple geometric design elements to reflect the dependability and stability that defines the TUF Gaming series.

Intel B560 Chipset

LGA 1200 CPU Socket

ATX Form Factor

Built to Take the Strain

Power Delivery EnhancementsTUF CAPACITORS

Proprietary capacitors provide up to 20% greater temperature tolerance and 5X-longer lifespan.

Power Delivery EnhancementsDIGI+VRM

The integrated Digi+ VRM voltage-regulator module (VRM) is one of the finest in the industry, ensuring ultra-smooth and ultra-clean power delivery to the CPU at all times.

Power Delivery EnhancementsTUF CHOKES

Certified military-grade TUF chokes deliver rock-steady power to the CPU, improving system stability.

POWER DELIVERY ENHANCEMENTSWith upgraded power delivery and comprehensive cooling options to drive the 11th and 10th Gen Intel® Core™ processors, plus support for faster memory and storage, TUF GAMING B560 series motherboards are the perfect foundation for your next high-core-count battle rig.

The onboard VRM of TUF GAMING B560 series motherboards utilizes 8+1 DrMOS power stages that combine high-side and low-side MOSFETs and drivers into a single package, delivering the power and efficiency that 11th Gen Intel Core processors demand. Multiple PCB layers shift heat away from critical components, providing more headroom to push CPUs beyond stock speeds. The motherboard also uses ProCool connectors that are built to tight specifications to ensure flush contact with PSU power lines. This results in lower impedance and helps to prevent hotspots and connector failure.

Cooler by Design

Identify

1. LARGER VRM HEATSINK

A larger, high-mass heatsink with extensive surface that covers the VRM and choke areas improves heat dissipation.

THERMAL PAD

High-quality thermal pads help transfer heat from the inductor and phase array to the heatsink.

2. M.2 HEATSINK

B560M-PLUS has a flexible M.2 heatsink to use on more M.2 slots and keep the M.2 SSD at the optimum operating temperature for consistent performance and reliability.

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